All Participants Issuers, Arrangers, Investors and Custodians are hereby informed that the Exchange has made available “BSE BOND” with effect from July 01, 2016 in line with SEBI circular no. CIR/IMD/DF1/48/2016 dated April 21, 2016 regarding Mechanism for issuance of debt securities on private placement basis through an Electronic Book Mechanism (“EBM”).
The BSE BOND platform has been upgraded as per nomenclatures entailed in the circular no: SEBI/HO/DDHS/CIR/P/2018/05 issued by SEBI on January 05, 2018. Detailed operating guidelines for BSE BOND platform were issued on March 28, 2018 and further revised effective from April 27, 2018
Furtherance to this SEBI has issued a New Circular; SEBI/HO/DDHS/CIR/P/2018/122 dated August 16, 2018 introducing certain additions and amendments read with SEBI circular no: SEBI/HO/DDHS/CIR/P/2018/05 issued by SEBI on January 05, 2018.
Please find appended below the revised operational guidelines for participation in “BSE BOND” of BSE in Annexure A. The guidelines also exhibit the requirements to be complied by Issuer(s)/ Arranger(s)/ QIB/Non-QIB investors/ Custodian(s) intending to select the Electronic Bidding Platform (“EBP”) of BSE- BSE BOND for issuances of securities on private placement basis.
The updated Operational Guidelines encompasses details on Mode of bidding (Open/ close), Multiple yield allotment, Multiple bids by Investor, Allotment on yield-time priority, Pay-in of funds through escrow bank account of Issuer ( as per the discretion of the Issuer).
The updated Operational Guidelines will be applicable to all issues announced and notified on or after October 1, 2018.
For any further clarifications, Issuer(s)/ Arranger(s)/ QIB/Non-QIB investor(s) / Custodian(s) may contact following officials at the Exchange:
Bhushan Mokashi
Additional General Manager
Listing Sales and Ops
September 28, 2018 |