Operational Guidelines for issuance of Securities on Private Placement basis through an Electronic Book Mechanism

• Notice No: 20180328-53
• Notice Date: 28 Mar 2018
• Category: Others
• Segment: Debt

 All Participants Issuers, Arrangers, Investors and Custodians are hereby informed that the Exchange has made available “BSE BOND” with effect from July 01, 2016 in line with SEBI circular no. CIR/IMD/DF1/48/2016 dated April 21, 2016 regarding Mechanism for issuance of debt securities on private placement basis through an Electronic Book Mechanism (“EBM”).

Detailed operating guidelines for BSE BOND platform were issued earlier on July 01, 2016 and on October 07, 2017. The BSE BOND platform has been upgraded as per nomenclatures entailed in the circular no: SEBI/HO/DDHS/CIR/P/2018/05 issued by SEBI on January 05, 2018.

Please find appended below the updated & revised operational guidelines for participation in “BSE BOND” of BSE in Annexure A. The guidelines also exhibit the requirements to be complied by Issuer(s)/ Arranger(s)/ QIB/Non-QIB investors/ Custodians intending to select the Electronic Bidding Platform (“EBP”) of BSE- BSE BOND for issuances of securities on private placement basis.

For any further clarifications, Issuer(s)/ Arranger(s)/ QIB/Non-QIB investor(s) / Custodian(s) may contact following officials at the Exchange:

Name of Official	Contact Number	Department	Email ID
Hemlata Agarwal	022 2272 8844	Listing Sales	[e-mail] / [e-mail]
Bharti Bhambwani	022 2272 8362	Listing Sales	[e-mail]/[e-mail]
Rahul Patil	022 2272 8392	Listing Sales	[e-mail]/ [e-mail]

Bhushan Mokashi

Additional General Manager

Listing Sales and Ops

March 28, 2018